INTERFAB ELECTRONICS (I) PVT. LTD.
 

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Micro Circuit Assemblies & Hybrid Modules

Product Code : 06

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Micro Circuit Assemblies & Hybrid Modules

The Advantages of SMT are

  • Miniaturization Higher packing Density
  • Higher reliability
  • Better performance
  • Modular Approach
  • Economical cost
  • High Production volumes
  • International Quality Standards

The State of The Art facility is now brought to you with following Machines & Equipments

  • Electronics Design Automation(EDA) Tools: Allegro, Cadence,USA.
  • Fine Pitch Multi function Mounter & Chip Shooter - KE2050RM,KE760M, JUKI Corporation Japan.
  • Lead Free Reflow Solder Machine SMD-CR-M7HAO
  • Reflow IR solder machine, SEF - 540.25, Germany.
  • Wave soldering machine, Elektra Aries, Sweden
  • Lead Free Wave Soldering ISO DWSM300LF
  • Selective soldering machines include: M56 , Wenesco ,USA.
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Multilayer Printed Circuit Board Assembly
Printed Cercuit Broad Wave Process
Printed Cercuit Broad Wave Process
Single Double Sided PCBs
Single Double Sided PCBs
Surface MountTechnology Smt
Surface MountTechnology Smt
 
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