Multilayer PCB Assembly

Design of high density, highly complex cards with large component package density needs to be handle separately with extraordinary electronic deign skills. INTERFAB believes in use of Appling innovations, integrated approach and total involvement to support customers in developing multilayer PCB design. The electronic design automation tools use in our CAD center support useful facture as out line below.

• Constraint Driven
• Floor planning and placement
• Design partitioning and Interactive auto editing
• Integrate high speed design analysis
• Reduces the time required to design high speed interconnects and increases the likelihood of first pass success.
• Shortens the time required to develop optimum constraints driven PCB designs flow
• Eliminates the need for physical prototype for multiple qualification of multi-Gigabit per second serial links through advanced simulation techniques
• Improve product quality cost and performance.