Our company specializes in design, proto typing and manufacturing of fine pitch PCB assemblies having fine pitch components such as ball grid arrays, micro BGA, TQFPs, Flip-chips, Chip scale packages(CSPs).
The proto typing of fine pitch boards is carried out using following steps
- Evalution of Design, Cad layouts, Gerber files
- Inspection of inward material (PCB, Components and Raw material)
- Programing of devices for automated assembly on Pick and place machines (Multi function chip mounter)
- In process Quality control and inspection at working stages namely Stencil painting, chip mounting, Reflow soldering.
- Validation of process Data of various parameters Required in fabrication Of PCBS, Stencils and setting of temperatures at various zones in Reflow Profile.
|
